CoBeam2 Die Technology

Die Sensing Technology

The All Sensors’ pressure sensor dies uses a proprietary Collinear Beam2 Technology registered as COBEAM² ™. This technology breakthrough advances the state of the art for piezoresistive pressure sensors beyond what has been achieved for low pressure sensing using silicon based strain technology. CoBeam2 TM Technology achieves a high level of pressure sensitivity previously requiring boss structures and larger die topologies. By eliminating the more typical boss structure in the design, both gravity and vibration sensitivity are significantly reduced. The strain sensitive resistors are processed to allow either constant current or voltage excitation through selection of temperature coefficients of resistance and sensitivity. The COBEAM² ™ Technology embodies aspects of 1950’s bonded strain gage sensors with state of the art MEMS processing of six inch silicon wafers.